- Product Details
Keywords
Quick Details
- ProName: 6H-Dibenz[c,e][1,2]oxaphosphorin 6-oxi...
- CasNo: 35948-25-5
- Molecular Formula: C12H9O2P
- Appearance: white powder/white crystal
- Application: flame retardant
- ProductionCapacity: /
- LimitNum: 0
Superiority
DOPOcontainsarigidphosphorusgroupandthusprovidebetterthermalandflame-retardantpropertiesthantheconventionalepoxyresinspreparedfromtetrabromobisphenolA…
Details
DOPO contains a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.